The first in a number of new products following recent years’ R&D efforts
MIGDAL HAEMEK, Israel , Sept. 24, 2024 /PRNewswire/ — Camtek Ltd. (NASDAQ: CAMT) (TASE: CAMT) is pleased to announce the launch of the latest leading inspection system, the Eagle Generation-5 (Eagle G5) , marking a significant advancement in Camtek’s inspection and metrology technological capabilities. The new system offers unparalleled wafer throughput coupled with improved optical resolution, meeting both current market demand and customers’ future roadmap.
Camtek’s Eagle system is the advanced packaging standard solution for current and future 2D inspection and 3D metrology, targeted to applications such as HPC (high performance computing), CIS (CMOS image sensors), SiC (Silicon Carbide), and others. Camtek has already received orders for this system for 2025 deliveries.
Rafi Amit , Camtek’s CEO commented, “I am very excited about the launch of our fifth generation Eagle platform. It pushes the boundaries of performance for inspection and metrology and I expect it to strengthen our dominant position in both the 2D inspection and 3D metrology in advanced packaging markets. This system is the first in a number of new products that we have been working on in recent years and will provide inspection and metrology solutions for the upcoming Advanced Packaging technologies that are characterized by fine pitch of micro bumps and hybrid bonding interconnects.”
“The healthy demand in our end-markets, together with the initial contribution from our new products, underlies our expectations that 2025 will be another growth year for Camtek.”
For more information about Camtek Ltd. and its advanced inspection and metrology solutions, please visit www.camtek.com .
ABOUT CAMTEK LTD.
Camtek is a developer and manufacturer of high-end inspection and metrology equipment for the semiconductor industry. Camtek’s systems inspect IC and measure IC features on wafers throughout the production process of semiconductor devices, covering the front and mid-end and up to the beginning of assembly (Post Dicing). Camtek’s systems inspect wafers for the most demanding semiconductor market segments, including Advanced Interconnect Packaging, Heterogenous Integration, Memory and HBM, CMOS Image Sensors, Compound Semiconductors, MEMS, and RF, serving numerous industry’s leading global IDMs, OSATs, and foundries.
With manufacturing facilities in Israel and Germany , and eight offices around the world, Camtek provides state of the art solutions in line with customers’ requirements.
This press release is available at www.camtek.com
This press release contains statements that may constitute “forward-looking statements” within the meaning of the Private Securities Litigation Reform Act of 1995. Such forward-looking statements are based on Camtek’s current beliefs, expectations and assumptions about its business and industry, all of which may change. Forward-looking statements can be identified by the use of words including “believe,” “anticipate,” “should,” “intend,” “plan,” “will,” “may,” “expect,” “estimate,” “project,” “positioned,” “strategy,” and similar expressions that are intended to identify forward-looking statements, including our expectations and statements relating to the compound semiconductors market and our position in this market and the anticipated timing of delivery of the systems. These forward-looking statements involve known and unknown risks and uncertainties that may cause the actual results, performance or achievements of Camtek to be materially different from any future results, performance or achievements expressed or implied by such forward-looking statements. Factors that may cause our actual results to differ materially from those contained in the forward-looking statements include, but are not limited to, the effects of the evolving nature of the war situation in Northern Israel , and the related evolving regional conflicts; the continued demand and future contribution of HBM and Chiplet applications and devices to the Company business resulting from, among other things, the field of AI surging worldwide across companies, industries and nations; formal or informal imposition by countries of new or revised export and/or import and doing-business regulations or sanctions, including but not limited to changes in U.S. trade policies, changes or uncertainty related to the U.S. government entity list and changes in the ability to sell products incorporating U.S originated technology, which can be made without prior notice, and our ability to effectively address such global trade issues and changes; ; and those other factors discussed in our Annual Report on Form 20-F as published on March 21, 2024 as well as other documents filed by the Company with the SEC as well as other documents that may be subsequently filed by Camtek from time to time with the Securities and Exchange Commission. We caution you not to place undue reliance on forward-looking statements, which speak only as of the date hereof. Camtek does not assume any obligation to update any forward-looking statements in order to reflect events or circumstances that may arise after the date of this release unless required by law.
While we believe that we have a reasonable basis for each forward-looking statement contained in this press release, we caution you that these statements are based on a combination of facts and factors currently known by us and our projections of the future, about which we cannot be certain. In addition, any forward-looking statements represent Camtek’s views only as of the date of this press release and should not be relied upon as representing its views as of any subsequent date. Camtek does not assume any obligation to update any forward-looking statements unless required by law.
CAMTEK LTD.
Moshe Eisenberg , CFO
Tel: +972 4 604 8308
Mobile: +972 54 900 7100
moshee@camtek.com
INTERNATIONAL INVESTOR RELATIONS
EK Global Investor Relations
Ehud Helft
Tel: (US) 1 212 378 8040
camtek@ekgir.com
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SOURCE Camtek Ltd.